Reflow soldering processes lee ning cheng. 0750672188 2019-01-25

Reflow soldering processes lee ning cheng Rating: 7,9/10 1000 reviews

Reflow Soldering Processes : Ning

reflow soldering processes lee ning cheng

Concentrated on mechanical developments in the field of hardware bundling and creation, this book clarifies the progressions in reflow binding procedures, its effect on imperfection components, and, as needs be, the investigating systems amid these procedures in an assortment of board sorts. May show signs of minor shelf wear and contain limited notes and highlighting. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes.

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Reflow soldering processes and troubleshooting : SMT, BGA, CSP, and flip chip technologies in SearchWorks catalog

reflow soldering processes lee ning cheng

It provides engineers the cutting-edge technology in a rapidly changing field. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. In view of cost adequacy premier, this book is intended to investigate mistakes or issues before loads up go into the assembling procedure, sparing time and cash toward the front. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.

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Reflow Soldering Processes

reflow soldering processes lee ning cheng

It explains and demonstrates all of the known possible defects I have ever encountered in my professional years and their respective causes and solutions. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Not on how things go when all is well, but on what things can go wrong, and how to fix, to compensate for, or to work around them when they do go wrong. My major criticism of the book is that the title doesn't do full justice to Dr. This excellent book on reflow soldering, by noted expert Doctor Ning-Cheng Lee, offers a unique approach that will be invaluable to anyone concerned with practical applications of microelectronics packaging. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.

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Reflow soldering processes and troubleshooting: SMT, BGA, CSP, and flip chip ...

reflow soldering processes lee ning cheng

The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. The first four chapters are a clear and complete exposition of reflow soldering and of surface mount assembly processes. An extensive list of references to technical literature follows each chapter, although only a specialist or a nut case would need to dig deeper than the material included in Dr. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types.

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0750672188

reflow soldering processes lee ning cheng

This chapter requires 39 sub-sections to systematically step through identifying, analyzing, and correcting defects. My major criticism of the book is that the title doesn't do full justice to Dr. Register a Free 1 month Trial Account. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Review This excellent book on reflow soldering, by noted expert Doctor Ning-Cheng Lee, offers a unique approach that will be invaluable to anyone concerned with the practical applications of microelectronics packaging.

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Reflow Soldering Processes and Troubleshootin By Ning

reflow soldering processes lee ning cheng

At less than one inch thick, this 280-page book can be easily slipped into an ordinary briefcase, and carried without muscle strain. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Further discussion extends this optimization approach to other alloys and systems, and suggests that your creativity might carry it still further. Lee makes good use of the large 7 by 10 inch format to place multiple graphics on almost every page.

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Reflow Soldering Processes and Troubleshootin By Ning

reflow soldering processes lee ning cheng

How to use the defects themselves to eliminate defects and to optimize your solder reflow process. Lee makes good use of the large 7 by 10 inch format to place multiple graphics on almost every page. I wish I could have gotten this book earlier. Lee makes good use of the large 7 by 10 inch format to place multiple graphics on almost every page. It provides engineers the cutting-edge technology in a rapidly changing field. Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types.

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Ning

reflow soldering processes lee ning cheng

Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. The writer's huge ability and information guarantee that scope of subjects is expertly investigated, composed, and sorted out to best address the issues of assembling process engineers, understudies, specialists, and anybody with a want to take in more about reflow welding forms. The problem is that once you have gotten your nifty new product, the reflow soldering processes lee ning cheng gets a brief glance, maybe a once over, but it often tends to get discarded or lost with the original packaging. How to cure or compensate for problems to achieve good solder reflow interconnections. May not contain Access Codes or Supplements. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. The next seven chapters place a strong focus on trouble-shooting.

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